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Bond
Bond Solder Paste
Weight : 1KG
Solder Paste is a homogeneous mixture of finely graded oxide free pre-alloyed solder powder suspended on a thixotropic flux. Extremely rapid flow and increased wetting are obtained on bond solder paste. RMA paste is a solder paste that consists of RMA type flux satisfying QQ-S-571E with very mild halide. Flux residue after soldering becomes highly reliable coating with excellent insulation resistance.
- Exhibits excellent wettability.
- Ensures minimal slumping and prevents solder balling and bridging.
- Low colour flux residue offers superior cosmetic appearance.